News Letter

Semiconductor packaging, PCB semiconductor at a glance...2021 KPCA Show.

As semiconductor substrates are expected to grow 17% this year, companies, including PCBs, packaging companies, and drug materials and equipment companies, are actively jumping into facility investment and new product development.

The 2021 International Electronic Circuit and Mounting Industry Exhibition (KPCA Show 2021), which opened in Songdo Convesia, Yeonsu-gu, Incheon on the 6th, introduced the PCB and semiconductor packaging industries. Samsung Electro-Mechanics showed off its technology by introducing its high-performance flip-chip-ball grid array (FC-BGA). FC-BGA is a highly integrated package substrate that improves electrical characteristics by connecting semiconductor chips and package substrates with flip chip pumps. Samsung Electro-Mechanics plans to invest 1 trillion won in semiconductor substrate facilities including FC-BGA.

LG Innotek unveiled new products such as 'Antenine Package (AiP), package substrates, and tape substrates for 5G mobile communication. It has applied technology that minimizes signal loss, which is essential for high-speed communication and information processing. LG Innotek is also considering FC-BGA business in response to the semiconductor substrate market.

PCB drug materials and equipment manufacturers also introduced a large number of new products. PCB equipment is also upgrading its products. Animotiontech unveiled an ultraviolet (UV) pico fine cutter. This product is picosecond laser equipment and is used to cut various PCBs. Precision processing is more advantageous than nanosecond laser equipment. In particular, it is characterized by minimizing carbonization or soot on the cut surface. It is expected that demand will expand as PCBs and packaging become ultra-small and lightweight. Meanwhile, 105 companies and institutions participated in the KPCA Show 2021.